Reflow oven RK320

Compact and Efficient Reflow Oven for SMT Production

Precision Benchtop Reflow Oven with Full Profile Control

The Reflow Oven RK320 is a fully automatic benchtop system tailored for prototyping and small-batch SMT production. With a max. heating area of 320 × 220 mm and a clearance of 35 mm, it supports both single- and double-sided PCB assemblies.

The unit features top and bottom heating, each independently and selectively controlled, enabling precise thermal profiles. Its programmable temperature curve setting in graphical mode, combined with 4 built-in thermocouples and an interface for an external probe, allows real-time monitoring directly on the PCB.

Thanks to forced air heating, dual-channel cooling, and a powerful yet energy-efficient design (typ. 1000 W), the RK320 delivers fast, reliable results — all within a compact 555 × 480 × 300 mm footprint.

Key Features

  • Max heating area: 320 × 220 mm
  • Top and bottom heaters controlled independently
  • Free programmable temperature curves (graphical mode)
  • 4 internal thermocouples + 1 external probe interface
  • Soldering temperature range: 30–290 °C
  • Cycle time: approx. 4–5 min per 300 × 200 mm PCB
  • Forced air heating with dual-channel cooling
  • Lead-free capable
  • Ethernet and USB interface for external PC
  • Fume extraction port (⌀ 80 mm)
  • Compact design: 555 × 480 × 300 mm, approx. 30 kg
  • Fully static operation – no moving rails
  • Large glass window for process observation
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