Reflow oven RK460

High-Power Reflow Oven with Expanded Process Capability

The RK460 is a high-performance benchtop reflow oven designed for advanced SMT soldering with larger PCBs and higher thermal demands. It features a generous 460 × 410 mm heating area and a clearance of 35 mm, suitable for both single- and double-sided assemblies.

Independently controlled top and bottom heaters, six internal thermocouples, and one external probe interface ensure precise thermal profiling and real-time control.

With a powerful 4800 W heating system and dual-channel air cooling, the RK460 delivers fast cycle times and optimal heat distribution across the board. Ethernet and USB connectivity, combined with static operation and a large glass viewing window, make it ideal for demanding prototype and small-batch production environments.

Key Features

• Large heating area: 460 × 410 mm
• Top and bottom heaters with selective control
• Free programmable temperature curve profiles
• 6 built-in thermocouples + 1 external interface
• Soldering temperature range: 30–300 °C
• Approx. 4–5 min cycle per 300 × 300 mm PCB
• High-power heating: max. 4800 W / typ. 2200 W
• Forced air heating and dual-channel fast cooling
• Lead-free compatible
• Ethernet and USB PC interface
• Fume extraction port (⌀ 80 mm)
• Fully static design (no moving rails)
• Large transparent glass process window
• Compact form factor: 675 × 630 × 300 mm, approx. 55 kg
• Power supply: 380 VAC / 50–60 Hz